High bandwidth routing for die to die interposer and on-chip applications

Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.

Bibliographische Detailangaben

Hauptverfasser:	Dabral, Sanjay, Chen, Huabo, Cheng, Zhenggang, Secker, David A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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