Metallic microneedles
Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method...
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creator | Mansoor, Iman Häfeli, Urs Otto Stoeber, Boris |
description | Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10207094B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10207094B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10207094B23</originalsourceid><addsrcrecordid>eNrjZBD1TS1JzMnJTFbIzUwuys9LTU3JSS3mYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBkYG5gaWJk5GxsSoAQCF1CFj</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Metallic microneedles</title><source>esp@cenet</source><creator>Mansoor, Iman ; Häfeli, Urs Otto ; Stoeber, Boris</creator><creatorcontrib>Mansoor, Iman ; Häfeli, Urs Otto ; Stoeber, Boris</creatorcontrib><description>Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.</description><language>eng</language><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY ; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR ; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROMTHE BODY ; HUMAN NECESSITIES ; HYGIENE ; MAKING NEEDLES, PINS OR NAILS OF METAL ; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL ; MEDICAL OR VETERINARY SCIENCE ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; PUNCHING METAL ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190219&DB=EPODOC&CC=US&NR=10207094B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190219&DB=EPODOC&CC=US&NR=10207094B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Mansoor, Iman</creatorcontrib><creatorcontrib>Häfeli, Urs Otto</creatorcontrib><creatorcontrib>Stoeber, Boris</creatorcontrib><title>Metallic microneedles</title><description>Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.</description><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY</subject><subject>DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR</subject><subject>DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROMTHE BODY</subject><subject>HUMAN NECESSITIES</subject><subject>HYGIENE</subject><subject>MAKING NEEDLES, PINS OR NAILS OF METAL</subject><subject>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</subject><subject>MEDICAL OR VETERINARY SCIENCE</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>PUNCHING METAL</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD1TS1JzMnJTFbIzUwuys9LTU3JSS3mYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBkYG5gaWJk5GxsSoAQCF1CFj</recordid><startdate>20190219</startdate><enddate>20190219</enddate><creator>Mansoor, Iman</creator><creator>Häfeli, Urs Otto</creator><creator>Stoeber, Boris</creator><scope>EVB</scope></search><sort><creationdate>20190219</creationdate><title>Metallic microneedles</title><author>Mansoor, Iman ; Häfeli, Urs Otto ; Stoeber, Boris</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10207094B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY</topic><topic>DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR</topic><topic>DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROMTHE BODY</topic><topic>HUMAN NECESSITIES</topic><topic>HYGIENE</topic><topic>MAKING NEEDLES, PINS OR NAILS OF METAL</topic><topic>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</topic><topic>MEDICAL OR VETERINARY SCIENCE</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>PUNCHING METAL</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Mansoor, Iman</creatorcontrib><creatorcontrib>Häfeli, Urs Otto</creatorcontrib><creatorcontrib>Stoeber, Boris</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Mansoor, Iman</au><au>Häfeli, Urs Otto</au><au>Stoeber, Boris</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Metallic microneedles</title><date>2019-02-19</date><risdate>2019</risdate><abstract>Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROMTHE BODY HUMAN NECESSITIES HYGIENE MAKING NEEDLES, PINS OR NAILS OF METAL MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL MEDICAL OR VETERINARY SCIENCE MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS PUNCHING METAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
title | Metallic microneedles |
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