Semiconductor chip package having a repeating footprint pattern

A semiconductor chip package includes a semiconductor chip disposed over a main surface of a carrier. An encapsulation body encapsulates the chip. First electrical contact elements are electrically coupled to the chip and protrude out of the encapsulation body through a first side face of the encaps...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Hoeglauer, Josef, Strassburg, Matthias, Schloegel, Xaver, Hud, Amirul Afiq, Chong, Chooi Mei, Schiess, Klaus, Otremba, Ralf, Wang, Lee Shuang, Lee, Teck Sim
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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