Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planes

Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide sandwiched between two ground layers. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Connor, Samuel R, Kuczynski, Joseph, Myers, Joshua C, Dreps, Daniel M, Hejase, Jose A, Tang, Junyan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE WAVEGUIDES
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