Apparatus for heating a substrate during die bonding

An apparatus for heating a substrate during die bonding is disclosed. The apparatus comprises: a substrate carrier configured to hold the substrate; a heating device configured to heat the substrate; a first actuator for effecting relative motion between the substrate carrier and the heating device...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Cheung, Chi Wai, Wan, Ming Yeung Luke, So, Chin Tung
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FURNACES HEATING KILNS LIGHTING MECHANICAL ENGINEERING OVENS RETORTS SEMICONDUCTOR DEVICES WEAPONS
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