Light emitting diode array on a backplane and method of making thereof

A backplane optionally having stepped horizontal surfaces and optionally embedding metal interconnect structures is provided. First conductive bonding structures are formed on first stepped horizontal surfaces. First light emitting devices on a first transfer substrate are disposed on the first cond...

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Bibliographische Detailangaben

Hauptverfasser:	Gardner, Nathan, Modric, Miljenko, Kish, Jr., Fredrick A, Danesh, Fariba, Thompson, Daniel Bryce, Pokhriyal, Anusha, Farrens, Sharon N
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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