Thermal conductive silicone composition

Provided is a heat-conducting silicone composition capable of maintaining low thermal resistance without causing peeling of heat-radiating grease even under severe reliability test conditions. The present invention is a heat-conducting silicone composition comprising: (A) an organopolysiloxane that has at least two alkenyl groups in a single molecule and a dynamic viscosity at 25°C of 10-100,000 mm2/s: 100 parts by mass; (B) a hydrolyzable methyl polysiloxane with one trifunctional end: 50-130 parts by mass; (C) an aluminum powder in which the mean particle diameter is 7 µm to 16 µm; (D) a zinc oxide powder in which the mean particle diameter is not more than 2 µm; (E) an organohydrogen polysiloxane; (F) an organohydrogen polysiloxane other than component (E) and containing at least two hydrogen atoms bonded to silicon atoms in a single molecule; and (G) a platinum hydrosilylation reaction catalyst: effective dose. When a liquid, in which said composition is mixed with a two-fold volume of toluene and dispersed, is sieved, the residue at 250 mesh (63 µm sieve opening) is not more than 5 ppm and the residue at 440 mesh (32 µm sieve opening) is at least 200 ppm.