Electronics package having a self-aligning interconnect assembly and method of making same

An electronics package includes an interconnect assembly comprising a first insulating substrate, a first wiring layer formed on a lower surface of the first insulating substrate, and at least one through hole extending through the first insulating substrate and the first wiring layer. The electroni...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Gowda, Arun Virupaksha, Kapusta, Christopher James, Rose, James Wilson, Nagarkar, Kaustubh Ravindra
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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