Profile of through via protrusion in 3DIC interconnect

An interconnect structure for an integrated circuit, such as a three dimensional integrated circuit (3DIC), and a method of forming the same is provided. An example interconnect structure includes a substrate, a through via extending through the substrate, and a liner disposed between the substrate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wu, Tsang-Jiuh, Lai, Kuan-Liang, Yu, Chen-Hua, Chung, Ming-Tsu, Yang, Ku-Feng, Chiou, Wen-Chih, Wu, Jiung, Shih, Hong-Ye, Jeng, Shin-Puu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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