Bolted wafer chuck thermal management systems and methods for wafer processing systems

A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lubomirsky, Dmitry, Benjaminson, David, Natarajan, Saravanakumar, Chourey, Shubham, Math, Ananda Seelavanth
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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