Bolted wafer chuck thermal management systems and methods for wafer processing systems
A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second...
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| creator | Lubomirsky, Dmitry Benjaminson, David Natarajan, Saravanakumar Chourey, Shubham Math, Ananda Seelavanth |
| description | A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10147620B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10147620B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10147620B23</originalsourceid><addsrcrecordid>eNqNyzsOwjAQRVE3FAjYw7AApCQg0geB6Pm00ch-iRH-yWOE2D1N6Kluc-5c3bvoCgy9eUAmbV_6ScUie3bkOfAIj1BIPlLghTgY8ig2GqEh5mlLOWqIPML4g0s1G9gJVlMXan06Xg_nDVLsIYk1Akp_u9RVvWv3TdU123_MF1Q_OjI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Bolted wafer chuck thermal management systems and methods for wafer processing systems</title><source>esp@cenet</source><creator>Lubomirsky, Dmitry ; Benjaminson, David ; Natarajan, Saravanakumar ; Chourey, Shubham ; Math, Ananda Seelavanth</creator><creatorcontrib>Lubomirsky, Dmitry ; Benjaminson, David ; Natarajan, Saravanakumar ; Chourey, Shubham ; Math, Ananda Seelavanth</creatorcontrib><description>A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181204&DB=EPODOC&CC=US&NR=10147620B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181204&DB=EPODOC&CC=US&NR=10147620B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Lubomirsky, Dmitry</creatorcontrib><creatorcontrib>Benjaminson, David</creatorcontrib><creatorcontrib>Natarajan, Saravanakumar</creatorcontrib><creatorcontrib>Chourey, Shubham</creatorcontrib><creatorcontrib>Math, Ananda Seelavanth</creatorcontrib><title>Bolted wafer chuck thermal management systems and methods for wafer processing systems</title><description>A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyzsOwjAQRVE3FAjYw7AApCQg0geB6Pm00ch-iRH-yWOE2D1N6Kluc-5c3bvoCgy9eUAmbV_6ScUie3bkOfAIj1BIPlLghTgY8ig2GqEh5mlLOWqIPML4g0s1G9gJVlMXan06Xg_nDVLsIYk1Akp_u9RVvWv3TdU123_MF1Q_OjI</recordid><startdate>20181204</startdate><enddate>20181204</enddate><creator>Lubomirsky, Dmitry</creator><creator>Benjaminson, David</creator><creator>Natarajan, Saravanakumar</creator><creator>Chourey, Shubham</creator><creator>Math, Ananda Seelavanth</creator><scope>EVB</scope></search><sort><creationdate>20181204</creationdate><title>Bolted wafer chuck thermal management systems and methods for wafer processing systems</title><author>Lubomirsky, Dmitry ; Benjaminson, David ; Natarajan, Saravanakumar ; Chourey, Shubham ; Math, Ananda Seelavanth</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10147620B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Lubomirsky, Dmitry</creatorcontrib><creatorcontrib>Benjaminson, David</creatorcontrib><creatorcontrib>Natarajan, Saravanakumar</creatorcontrib><creatorcontrib>Chourey, Shubham</creatorcontrib><creatorcontrib>Math, Ananda Seelavanth</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Lubomirsky, Dmitry</au><au>Benjaminson, David</au><au>Natarajan, Saravanakumar</au><au>Chourey, Shubham</au><au>Math, Ananda Seelavanth</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Bolted wafer chuck thermal management systems and methods for wafer processing systems</title><date>2018-12-04</date><risdate>2018</risdate><abstract>A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Bolted wafer chuck thermal management systems and methods for wafer processing systems |
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