Non-contact temperature measurement sensor

The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Hermann, Judy, Lei, Kuolung, Easson, Craig A, Emadi, Arvin, Bhat, Jerome C
Format: Patent
Sprache:eng
Schlagworte:
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