Non-contact temperature measurement sensor
The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrat...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Hermann, Judy Lei, Kuolung Easson, Craig A Emadi, Arvin Bhat, Jerome C |
description | The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10113915B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10113915B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10113915B13</originalsourceid><addsrcrecordid>eNrjZNDyy8_TTc7PK0lMLlEoSc0tSC1KLCktSlXITU0sBtK5qXklCsWpecX5RTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JD402NDA0NDY0tDUydCYGDUAclspvw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Non-contact temperature measurement sensor</title><source>esp@cenet</source><creator>Hermann, Judy ; Lei, Kuolung ; Easson, Craig A ; Emadi, Arvin ; Bhat, Jerome C</creator><creatorcontrib>Hermann, Judy ; Lei, Kuolung ; Easson, Craig A ; Emadi, Arvin ; Bhat, Jerome C</creatorcontrib><description>The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.</description><language>eng</language><subject>COLORIMETRY ; MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT ; MEASURING ; MEASURING QUANTITY OF HEAT ; MEASURING TEMPERATURE ; PHYSICS ; RADIATION PYROMETRY ; TESTING ; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181030&DB=EPODOC&CC=US&NR=10113915B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181030&DB=EPODOC&CC=US&NR=10113915B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hermann, Judy</creatorcontrib><creatorcontrib>Lei, Kuolung</creatorcontrib><creatorcontrib>Easson, Craig A</creatorcontrib><creatorcontrib>Emadi, Arvin</creatorcontrib><creatorcontrib>Bhat, Jerome C</creatorcontrib><title>Non-contact temperature measurement sensor</title><description>The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.</description><subject>COLORIMETRY</subject><subject>MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT</subject><subject>MEASURING</subject><subject>MEASURING QUANTITY OF HEAT</subject><subject>MEASURING TEMPERATURE</subject><subject>PHYSICS</subject><subject>RADIATION PYROMETRY</subject><subject>TESTING</subject><subject>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDyy8_TTc7PK0lMLlEoSc0tSC1KLCktSlXITU0sBtK5qXklCsWpecX5RTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JD402NDA0NDY0tDUydCYGDUAclspvw</recordid><startdate>20181030</startdate><enddate>20181030</enddate><creator>Hermann, Judy</creator><creator>Lei, Kuolung</creator><creator>Easson, Craig A</creator><creator>Emadi, Arvin</creator><creator>Bhat, Jerome C</creator><scope>EVB</scope></search><sort><creationdate>20181030</creationdate><title>Non-contact temperature measurement sensor</title><author>Hermann, Judy ; Lei, Kuolung ; Easson, Craig A ; Emadi, Arvin ; Bhat, Jerome C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10113915B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>COLORIMETRY</topic><topic>MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT</topic><topic>MEASURING</topic><topic>MEASURING QUANTITY OF HEAT</topic><topic>MEASURING TEMPERATURE</topic><topic>PHYSICS</topic><topic>RADIATION PYROMETRY</topic><topic>TESTING</topic><topic>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</topic><toplevel>online_resources</toplevel><creatorcontrib>Hermann, Judy</creatorcontrib><creatorcontrib>Lei, Kuolung</creatorcontrib><creatorcontrib>Easson, Craig A</creatorcontrib><creatorcontrib>Emadi, Arvin</creatorcontrib><creatorcontrib>Bhat, Jerome C</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hermann, Judy</au><au>Lei, Kuolung</au><au>Easson, Craig A</au><au>Emadi, Arvin</au><au>Bhat, Jerome C</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Non-contact temperature measurement sensor</title><date>2018-10-30</date><risdate>2018</risdate><abstract>The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US10113915B1 |
source | esp@cenet |
subjects | COLORIMETRY MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS RADIATION PYROMETRY TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR |
title | Non-contact temperature measurement sensor |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-16T18%3A01%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Hermann,%20Judy&rft.date=2018-10-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10113915B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |