Foamed sheet
A foamed sheet according to the present invention has a thickness of 30 to 500 μm and includes a foam. The foam has a density of 0.2 to 0.7 g/cm3, an average cell diameter of 10 to 150 μm, and a peak top of loss tangent (tan δ) occurring in a temperature range of from −30° C. to 30° C., where the lo...
Gespeichert in:
| Hauptverfasser: | , , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Otsuka, Tetsuya Kato, Kazumichi Takahashi, Tadao Doi, Kohei Tokuyama, Hideyuki Kitahara, Tsunaki Okada, Mika Nagasaki, Kunio Matsushita, Kiichiro |
| description | A foamed sheet according to the present invention has a thickness of 30 to 500 μm and includes a foam. The foam has a density of 0.2 to 0.7 g/cm3, an average cell diameter of 10 to 150 μm, and a peak top of loss tangent (tan δ) occurring in a temperature range of from −30° C. to 30° C., where the loss tangent is defined as the ratio of a loss modulus to a storage modulus determined at an angular frequency of 1 rad/s in dynamic viscoelastic measurement of the foam. The foam preferably has a maximum of the loss tangent (tan δ) in the temperature range of from −30° C. to 30° C. of 0.2 or more. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10105929B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10105929B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10105929B23</originalsourceid><addsrcrecordid>eNrjZOBxy0_MTU1RKM5ITS3hYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBoYGppZGlk5GxsSoAQD7PR2i</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Foamed sheet</title><source>esp@cenet</source><creator>Otsuka, Tetsuya ; Kato, Kazumichi ; Takahashi, Tadao ; Doi, Kohei ; Tokuyama, Hideyuki ; Kitahara, Tsunaki ; Okada, Mika ; Nagasaki, Kunio ; Matsushita, Kiichiro</creator><creatorcontrib>Otsuka, Tetsuya ; Kato, Kazumichi ; Takahashi, Tadao ; Doi, Kohei ; Tokuyama, Hideyuki ; Kitahara, Tsunaki ; Okada, Mika ; Nagasaki, Kunio ; Matsushita, Kiichiro</creatorcontrib><description>A foamed sheet according to the present invention has a thickness of 30 to 500 μm and includes a foam. The foam has a density of 0.2 to 0.7 g/cm3, an average cell diameter of 10 to 150 μm, and a peak top of loss tangent (tan δ) occurring in a temperature range of from −30° C. to 30° C., where the loss tangent is defined as the ratio of a loss modulus to a storage modulus determined at an angular frequency of 1 rad/s in dynamic viscoelastic measurement of the foam. The foam preferably has a maximum of the loss tangent (tan δ) in the temperature range of from −30° C. to 30° C. of 0.2 or more.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; PRINTED CIRCUITS ; TELEPHONIC COMMUNICATION ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES ; WORKING-UP</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181023&DB=EPODOC&CC=US&NR=10105929B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181023&DB=EPODOC&CC=US&NR=10105929B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Otsuka, Tetsuya</creatorcontrib><creatorcontrib>Kato, Kazumichi</creatorcontrib><creatorcontrib>Takahashi, Tadao</creatorcontrib><creatorcontrib>Doi, Kohei</creatorcontrib><creatorcontrib>Tokuyama, Hideyuki</creatorcontrib><creatorcontrib>Kitahara, Tsunaki</creatorcontrib><creatorcontrib>Okada, Mika</creatorcontrib><creatorcontrib>Nagasaki, Kunio</creatorcontrib><creatorcontrib>Matsushita, Kiichiro</creatorcontrib><title>Foamed sheet</title><description>A foamed sheet according to the present invention has a thickness of 30 to 500 μm and includes a foam. The foam has a density of 0.2 to 0.7 g/cm3, an average cell diameter of 10 to 150 μm, and a peak top of loss tangent (tan δ) occurring in a temperature range of from −30° C. to 30° C., where the loss tangent is defined as the ratio of a loss modulus to a storage modulus determined at an angular frequency of 1 rad/s in dynamic viscoelastic measurement of the foam. The foam preferably has a maximum of the loss tangent (tan δ) in the temperature range of from −30° C. to 30° C. of 0.2 or more.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>TELEPHONIC COMMUNICATION</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOBxy0_MTU1RKM5ITS3hYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBoYGppZGlk5GxsSoAQD7PR2i</recordid><startdate>20181023</startdate><enddate>20181023</enddate><creator>Otsuka, Tetsuya</creator><creator>Kato, Kazumichi</creator><creator>Takahashi, Tadao</creator><creator>Doi, Kohei</creator><creator>Tokuyama, Hideyuki</creator><creator>Kitahara, Tsunaki</creator><creator>Okada, Mika</creator><creator>Nagasaki, Kunio</creator><creator>Matsushita, Kiichiro</creator><scope>EVB</scope></search><sort><creationdate>20181023</creationdate><title>Foamed sheet</title><author>Otsuka, Tetsuya ; Kato, Kazumichi ; Takahashi, Tadao ; Doi, Kohei ; Tokuyama, Hideyuki ; Kitahara, Tsunaki ; Okada, Mika ; Nagasaki, Kunio ; Matsushita, Kiichiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10105929B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>TELEPHONIC COMMUNICATION</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>Otsuka, Tetsuya</creatorcontrib><creatorcontrib>Kato, Kazumichi</creatorcontrib><creatorcontrib>Takahashi, Tadao</creatorcontrib><creatorcontrib>Doi, Kohei</creatorcontrib><creatorcontrib>Tokuyama, Hideyuki</creatorcontrib><creatorcontrib>Kitahara, Tsunaki</creatorcontrib><creatorcontrib>Okada, Mika</creatorcontrib><creatorcontrib>Nagasaki, Kunio</creatorcontrib><creatorcontrib>Matsushita, Kiichiro</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Otsuka, Tetsuya</au><au>Kato, Kazumichi</au><au>Takahashi, Tadao</au><au>Doi, Kohei</au><au>Tokuyama, Hideyuki</au><au>Kitahara, Tsunaki</au><au>Okada, Mika</au><au>Nagasaki, Kunio</au><au>Matsushita, Kiichiro</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Foamed sheet</title><date>2018-10-23</date><risdate>2018</risdate><abstract>A foamed sheet according to the present invention has a thickness of 30 to 500 μm and includes a foam. The foam has a density of 0.2 to 0.7 g/cm3, an average cell diameter of 10 to 150 μm, and a peak top of loss tangent (tan δ) occurring in a temperature range of from −30° C. to 30° C., where the loss tangent is defined as the ratio of a loss modulus to a storage modulus determined at an angular frequency of 1 rad/s in dynamic viscoelastic measurement of the foam. The foam preferably has a maximum of the loss tangent (tan δ) in the temperature range of from −30° C. to 30° C. of 0.2 or more.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US10105929B2 |
| source | esp@cenet |
| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TELEPHONIC COMMUNICATION THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING-UP |
| title | Foamed sheet |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T20%3A33%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Otsuka,%20Tetsuya&rft.date=2018-10-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10105929B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |