Inductive monitoring of conductive trench depth

In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the subst...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Iravani, Hassan G, Wang, Zhefu, Lu, Wei, Wang, Zhihong, Benvegnu, Dominic J, Carlsson, Ingemar, Swedek, Boguslaw A, Tu, Wen-Chiang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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