Method of manufacturing light emitting element and light emitting device including forming resin film including phosphor containing layer

Method of manufacturing light emitting element and light emitting device including forming resin film including phosphor containing layer

A method of manufacturing a light emitting element includes forming a resin film including a phosphor containing layer on a transparent board side surface of a wafer including a transparent board and a plurality of light emitting parts formed on the transparent board, forming a scribing line along a...

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Hauptverfasser: Tanaka, Motoyuki, Tsuchiya, Yosuke, Kawaoka, Aya, Ishida, Makoto
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Tanaka, Motoyuki
Tsuchiya, Yosuke
Kawaoka, Aya
Ishida, Makoto
description A method of manufacturing a light emitting element includes forming a resin film including a phosphor containing layer on a transparent board side surface of a wafer including a transparent board and a plurality of light emitting parts formed on the transparent board, forming a scribing line along a scheduled separation surface in a surface of the transparent board by scribing before or after forming the resin film, cutting the resin film along the scheduled separation surface before or after forming the scribing line, and separating the transparent board along the scheduled separation surface by breaking after forming the scribing line and cutting the resin film.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10096585B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10096585B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10096585B23</originalsourceid><addsrcrecordid>eNqNjT0KAjEQhbexEPUO4wGEVVnRVlFsrNR6CclkM5BMlmRW8AjeWlcsxMri8fF-4A2LxwnFRQPRQlDcWaWlS8QNeGqcAAYS6S16DMgCis1vZfBGGoFY-870gY0p9EyYicGSD19l62J-KYGOLIr4_aXumMbFwCqfcfLhqJge9pfdcYZtrDG3SiOj1NfzvCw3q2pdbRfLfzZPvO5N4A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of manufacturing light emitting element and light emitting device including forming resin film including phosphor containing layer</title><source>esp@cenet</source><creator>Tanaka, Motoyuki ; Tsuchiya, Yosuke ; Kawaoka, Aya ; Ishida, Makoto</creator><creatorcontrib>Tanaka, Motoyuki ; Tsuchiya, Yosuke ; Kawaoka, Aya ; Ishida, Makoto</creatorcontrib><description>A method of manufacturing a light emitting element includes forming a resin film including a phosphor containing layer on a transparent board side surface of a wafer including a transparent board and a plurality of light emitting parts formed on the transparent board, forming a scribing line along a scheduled separation surface in a surface of the transparent board by scribing before or after forming the resin film, cutting the resin film along the scheduled separation surface before or after forming the scribing line, and separating the transparent board along the scheduled separation surface by breaking after forming the scribing line and cutting the resin film.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20181009&amp;DB=EPODOC&amp;CC=US&amp;NR=10096585B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20181009&amp;DB=EPODOC&amp;CC=US&amp;NR=10096585B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Tanaka, Motoyuki</creatorcontrib><creatorcontrib>Tsuchiya, Yosuke</creatorcontrib><creatorcontrib>Kawaoka, Aya</creatorcontrib><creatorcontrib>Ishida, Makoto</creatorcontrib><title>Method of manufacturing light emitting element and light emitting device including forming resin film including phosphor containing layer</title><description>A method of manufacturing a light emitting element includes forming a resin film including a phosphor containing layer on a transparent board side surface of a wafer including a transparent board and a plurality of light emitting parts formed on the transparent board, forming a scribing line along a scheduled separation surface in a surface of the transparent board by scribing before or after forming the resin film, cutting the resin film along the scheduled separation surface before or after forming the scribing line, and separating the transparent board along the scheduled separation surface by breaking after forming the scribing line and cutting the resin film.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjT0KAjEQhbexEPUO4wGEVVnRVlFsrNR6CclkM5BMlmRW8AjeWlcsxMri8fF-4A2LxwnFRQPRQlDcWaWlS8QNeGqcAAYS6S16DMgCis1vZfBGGoFY-870gY0p9EyYicGSD19l62J-KYGOLIr4_aXumMbFwCqfcfLhqJge9pfdcYZtrDG3SiOj1NfzvCw3q2pdbRfLfzZPvO5N4A</recordid><startdate>20181009</startdate><enddate>20181009</enddate><creator>Tanaka, Motoyuki</creator><creator>Tsuchiya, Yosuke</creator><creator>Kawaoka, Aya</creator><creator>Ishida, Makoto</creator><scope>EVB</scope></search><sort><creationdate>20181009</creationdate><title>Method of manufacturing light emitting element and light emitting device including forming resin film including phosphor containing layer</title><author>Tanaka, Motoyuki ; Tsuchiya, Yosuke ; Kawaoka, Aya ; Ishida, Makoto</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10096585B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Tanaka, Motoyuki</creatorcontrib><creatorcontrib>Tsuchiya, Yosuke</creatorcontrib><creatorcontrib>Kawaoka, Aya</creatorcontrib><creatorcontrib>Ishida, Makoto</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tanaka, Motoyuki</au><au>Tsuchiya, Yosuke</au><au>Kawaoka, Aya</au><au>Ishida, Makoto</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of manufacturing light emitting element and light emitting device including forming resin film including phosphor containing layer</title><date>2018-10-09</date><risdate>2018</risdate><abstract>A method of manufacturing a light emitting element includes forming a resin film including a phosphor containing layer on a transparent board side surface of a wafer including a transparent board and a plurality of light emitting parts formed on the transparent board, forming a scribing line along a scheduled separation surface in a surface of the transparent board by scribing before or after forming the resin film, cutting the resin film along the scheduled separation surface before or after forming the scribing line, and separating the transparent board along the scheduled separation surface by breaking after forming the scribing line and cutting the resin film.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method of manufacturing light emitting element and light emitting device including forming resin film including phosphor containing layer
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-22T10%3A25%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Tanaka,%20Motoyuki&rft.date=2018-10-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10096585B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true