Hardware shield device and electronic devices including the same
A hardware shield device and an electronic device are provided. The device and electronic device include a shield can including an opening through which at least a part of a device element is exposed, a heat dissipation module including at least a part that is mounted on the opening, a cover member...
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creator | Choi, Seung Ki Hur, Jun Choi, Seung Bum |
description | A hardware shield device and an electronic device are provided. The device and electronic device include a shield can including an opening through which at least a part of a device element is exposed, a heat dissipation module including at least a part that is mounted on the opening, a cover member connected to one surface of the heat dissipation module, and a conductor arranged between the shield can and the cover member, the conductor surrounding both the opening and at least a part of a periphery of the heat dissipation module. |
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The device and electronic device include a shield can including an opening through which at least a part of a device element is exposed, a heat dissipation module including at least a part that is mounted on the opening, a cover member connected to one surface of the heat dissipation module, and a conductor arranged between the shield can and the cover member, the conductor surrounding both the opening and at least a part of a periphery of the heat dissipation module.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181009&DB=EPODOC&CC=US&NR=10095283B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181009&DB=EPODOC&CC=US&NR=10095283B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Choi, Seung Ki</creatorcontrib><creatorcontrib>Hur, Jun</creatorcontrib><creatorcontrib>Choi, Seung Bum</creatorcontrib><title>Hardware shield device and electronic devices including the same</title><description>A hardware shield device and an electronic device are provided. 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The device and electronic device include a shield can including an opening through which at least a part of a device element is exposed, a heat dissipation module including at least a part that is mounted on the opening, a cover member connected to one surface of the heat dissipation module, and a conductor arranged between the shield can and the cover member, the conductor surrounding both the opening and at least a part of a periphery of the heat dissipation module.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng |
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subjects | BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
title | Hardware shield device and electronic devices including the same |
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