Hardware shield device and electronic devices including the same

A hardware shield device and an electronic device are provided. The device and electronic device include a shield can including an opening through which at least a part of a device element is exposed, a heat dissipation module including at least a part that is mounted on the opening, a cover member...

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Hauptverfasser: Choi, Seung Ki, Hur, Jun, Choi, Seung Bum
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Sprache:eng
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creator Choi, Seung Ki
Hur, Jun
Choi, Seung Bum
description A hardware shield device and an electronic device are provided. The device and electronic device include a shield can including an opening through which at least a part of a device element is exposed, a heat dissipation module including at least a part that is mounted on the opening, a cover member connected to one surface of the heat dissipation module, and a conductor arranged between the shield can and the cover member, the conductor surrounding both the opening and at least a part of a periphery of the heat dissipation module.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10095283B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10095283B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10095283B23</originalsourceid><addsrcrecordid>eNrjZHDwSCxKKU8sSlUozshMzUlRSEkty0xOVUjMS1FIzUlNLinKz8tMhooWK2TmJeeUpmTmpSuUZAC1JOam8jCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSS-NBgQwMDS1MjC2MnI2Ni1AAAvPsxTA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Hardware shield device and electronic devices including the same</title><source>esp@cenet</source><creator>Choi, Seung Ki ; Hur, Jun ; Choi, Seung Bum</creator><creatorcontrib>Choi, Seung Ki ; Hur, Jun ; Choi, Seung Bum</creatorcontrib><description>A hardware shield device and an electronic device are provided. The device and electronic device include a shield can including an opening through which at least a part of a device element is exposed, a heat dissipation module including at least a part that is mounted on the opening, a cover member connected to one surface of the heat dissipation module, and a conductor arranged between the shield can and the cover member, the conductor surrounding both the opening and at least a part of a periphery of the heat dissipation module.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20181009&amp;DB=EPODOC&amp;CC=US&amp;NR=10095283B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20181009&amp;DB=EPODOC&amp;CC=US&amp;NR=10095283B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Choi, Seung Ki</creatorcontrib><creatorcontrib>Hur, Jun</creatorcontrib><creatorcontrib>Choi, Seung Bum</creatorcontrib><title>Hardware shield device and electronic devices including the same</title><description>A hardware shield device and an electronic device are provided. The device and electronic device include a shield can including an opening through which at least a part of a device element is exposed, a heat dissipation module including at least a part that is mounted on the opening, a cover member connected to one surface of the heat dissipation module, and a conductor arranged between the shield can and the cover member, the conductor surrounding both the opening and at least a part of a periphery of the heat dissipation module.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDwSCxKKU8sSlUozshMzUlRSEkty0xOVUjMS1FIzUlNLinKz8tMhooWK2TmJeeUpmTmpSuUZAC1JOam8jCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSS-NBgQwMDS1MjC2MnI2Ni1AAAvPsxTA</recordid><startdate>20181009</startdate><enddate>20181009</enddate><creator>Choi, Seung Ki</creator><creator>Hur, Jun</creator><creator>Choi, Seung Bum</creator><scope>EVB</scope></search><sort><creationdate>20181009</creationdate><title>Hardware shield device and electronic devices including the same</title><author>Choi, Seung Ki ; Hur, Jun ; Choi, Seung Bum</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10095283B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Choi, Seung Ki</creatorcontrib><creatorcontrib>Hur, Jun</creatorcontrib><creatorcontrib>Choi, Seung Bum</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Choi, Seung Ki</au><au>Hur, Jun</au><au>Choi, Seung Bum</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Hardware shield device and electronic devices including the same</title><date>2018-10-09</date><risdate>2018</risdate><abstract>A hardware shield device and an electronic device are provided. The device and electronic device include a shield can including an opening through which at least a part of a device element is exposed, a heat dissipation module including at least a part that is mounted on the opening, a cover member connected to one surface of the heat dissipation module, and a conductor arranged between the shield can and the cover member, the conductor surrounding both the opening and at least a part of a periphery of the heat dissipation module.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title Hardware shield device and electronic devices including the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T04%3A57%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Choi,%20Seung%20Ki&rft.date=2018-10-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10095283B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true