Membrane bonding with photoresist
Systems and techniques are provided for membrane bonding. A photoresist may be applied to an ultrasonic device. A portion of the photoresist may be removed. A bonding agent may be applied a portion of the photoresist that is not removed. A membrane may be placed on the ultrasonic device such that th...
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| creator | Elhadad, Adam Stephen Taffler, Sean Faraji, Boozarjomehr Nemeth, Nicholas Lavada Joyce, Andrew Reynolds, Paul |
| description | Systems and techniques are provided for membrane bonding. A photoresist may be applied to an ultrasonic device. A portion of the photoresist may be removed. A bonding agent may be applied a portion of the photoresist that is not removed. A membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent and the photoresist. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate. |
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A photoresist may be applied to an ultrasonic device. A portion of the photoresist may be removed. A bonding agent may be applied a portion of the photoresist that is not removed. A membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent and the photoresist. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate.</description><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; BLASTING ; CINEMATOGRAPHY ; DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; ENGINEERING ELEMENTS AND UNITS ; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS ; HEATING ; HOLOGRAPHY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; LIGHTING ; MATERIALS THEREFOR ; MECHANICAL ENGINEERING ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; THERMAL INSULATION IN GENERAL ; TRANSPORTING ; WEAPONS ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180904&DB=EPODOC&CC=US&NR=10065854B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180904&DB=EPODOC&CC=US&NR=10065854B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Elhadad, Adam Stephen</creatorcontrib><creatorcontrib>Taffler, Sean</creatorcontrib><creatorcontrib>Faraji, Boozarjomehr</creatorcontrib><creatorcontrib>Nemeth, Nicholas Lavada</creatorcontrib><creatorcontrib>Joyce, Andrew</creatorcontrib><creatorcontrib>Reynolds, Paul</creatorcontrib><title>Membrane bonding with photoresist</title><description>Systems and techniques are provided for membrane bonding. A photoresist may be applied to an ultrasonic device. A portion of the photoresist may be removed. A bonding agent may be applied a portion of the photoresist that is not removed. A membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent and the photoresist. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CINEMATOGRAPHY</subject><subject>DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>ENGINEERING ELEMENTS AND UNITS</subject><subject>GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS</subject><subject>HEATING</subject><subject>HOLOGRAPHY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>LIGHTING</subject><subject>MATERIALS THEREFOR</subject><subject>MECHANICAL ENGINEERING</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>THERMAL INSULATION IN GENERAL</subject><subject>TRANSPORTING</subject><subject>WEAPONS</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD0Tc1NKkrMS1VIys9LycxLVyjPLMlQKMjIL8kvSi3OLC7hYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBgZmphamJk5GxsSoAQCirSYe</recordid><startdate>20180904</startdate><enddate>20180904</enddate><creator>Elhadad, Adam Stephen</creator><creator>Taffler, Sean</creator><creator>Faraji, Boozarjomehr</creator><creator>Nemeth, Nicholas Lavada</creator><creator>Joyce, Andrew</creator><creator>Reynolds, Paul</creator><scope>EVB</scope></search><sort><creationdate>20180904</creationdate><title>Membrane bonding with photoresist</title><author>Elhadad, Adam Stephen ; Taffler, Sean ; Faraji, Boozarjomehr ; Nemeth, Nicholas Lavada ; Joyce, Andrew ; Reynolds, Paul</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10065854B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CINEMATOGRAPHY</topic><topic>DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>ENGINEERING ELEMENTS AND UNITS</topic><topic>GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS</topic><topic>HEATING</topic><topic>HOLOGRAPHY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>LIGHTING</topic><topic>MATERIALS THEREFOR</topic><topic>MECHANICAL ENGINEERING</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>THERMAL INSULATION IN GENERAL</topic><topic>TRANSPORTING</topic><topic>WEAPONS</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>Elhadad, Adam Stephen</creatorcontrib><creatorcontrib>Taffler, Sean</creatorcontrib><creatorcontrib>Faraji, Boozarjomehr</creatorcontrib><creatorcontrib>Nemeth, Nicholas Lavada</creatorcontrib><creatorcontrib>Joyce, Andrew</creatorcontrib><creatorcontrib>Reynolds, Paul</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Elhadad, Adam Stephen</au><au>Taffler, Sean</au><au>Faraji, Boozarjomehr</au><au>Nemeth, Nicholas Lavada</au><au>Joyce, Andrew</au><au>Reynolds, Paul</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Membrane bonding with photoresist</title><date>2018-09-04</date><risdate>2018</risdate><abstract>Systems and techniques are provided for membrane bonding. A photoresist may be applied to an ultrasonic device. A portion of the photoresist may be removed. A bonding agent may be applied a portion of the photoresist that is not removed. A membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent and the photoresist. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS BLASTING CINEMATOGRAPHY DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING HOLOGRAPHY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LIGHTING MATERIALS THEREFOR MECHANICAL ENGINEERING MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THERMAL INSULATION IN GENERAL TRANSPORTING WEAPONS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Membrane bonding with photoresist |
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