Package-on-package assembly with wire bonds to encapsulation surface

Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectroni...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Osborn, Philip R, Sato, Hiroaki, Chau, Ellis, Inetaro, Kurosawa, Kang, Teck-Gyu, Mohammed, Ilyas, Hashimoto, Kiyoaki, Sakuma, Kazuo, Kikuchi, Tomoyuki, Haba, Belgacem, Wang, Wei-Shun, Masuda, Norihito
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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