Composite bond structure in stacked semiconductor structure

A semiconductor device includes a substrate, a dielectric structure, a top metal layer and a bonding structure. The dielectric structure is disposed on the substrate. The top metal layer is disposed in the dielectric structure. The bonding structure is disposed on the dielectric structure and the to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wu, Cheng-Yi, Li, Sheng-Chan, Chang, Chao-Ching, Lin, Min-Hui, Tsai, Wen-Jen, Tsai, Jian-Shin, Huang, Chih-Hui, Lin, Yi-Ming
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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