Silicon package for embedded semiconductor chip and power converter

A packaged transistor device (100) comprises a semiconductor chip (101) including a transistor with terminals distributed on the first and the opposite second chip side; and a slab (110) of low-grade silicon (l-g-Si) configured as a ridge (111) framing a depression including a recessed central area...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lopez, Osvaldo Jorge, Grebs, Tom, Molloy, Simon John, Noquil, Jonathan Almeria
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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