Manufacuting method of semiconductor structure

The present disclosure provides a semiconductor structure. The structure includes a first substrate; a first dielectric layer having a first surface in proximity to the first substrate and a second surface away from the first substrate; a first interconnect penetrating the first surface of the first...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Hsu, Yung-Lung, Chen, Po-Zen, Tsai, Tsung-Han, Liao, Keng-Ying, Chien, Volume, Tseng, Chung-Bin
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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