PCD wafer without substrate for high pressure / high temperature sintering

A method of forming a cutting element may include subjecting a first press containing at least a diamond powder-containing container and a volume of a high melting temperature non-reactive material to a first high pressure high temperature sintering condition to form a sintered polycrystalline diamo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Eyre, Ronald K, Bao, Yahua
Format:	Patent
Sprache:	eng
Schlagworte:	EARTH DRILLING EARTH DRILLING, e.g. DEEP DRILLING FIXED CONSTRUCTIONS GRINDING MINING OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR ASLURRY OF MINERALS FROM WELLS PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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