Inspecting a wafer using image and design information

A method for inspecting a group of dies of a wafer, wherein the wafer comprises a group of wafer segments, wherein each wafer segment comprises a die of the group of dies, a molded material that surrounds the die and redistribution layer (RDL) conductors that are coupled to the die and are positione...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Regensburger, Menachem, Postolov, Yuri
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS
Online-Zugang:	Volltext bestellen
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