Semiconductor device and method of manufacturing the same

In a resin sealing type semiconductor device, a semiconductor chip CP2 is mounted over a die pad DP having conductivity via a bonding member BD2 having insulation property, and a semiconductor chip CP1 is mounted over the die pad DP via a bonding member BD1 having conductivity. A first length of a p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Nakamura, Hiroyuki, Yato, Yuichi, Danno, Tadatoshi, Oka, Hiroi, Nishikizawa, Atsushi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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