Three-dimensional chip-to-wafer integration

An integrated circuit device is disclosed that includes a semiconductor substrate and a die attached to the semiconductor substrate. A conductive pillar is connected to at least one of the semiconductor substrate or the die. An overmold is molded onto the semiconductor substrate over the die, and th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kelkar, Amit S, Thambidurai, Karthik, Khandekar, Viren, Nguyen, Hien D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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