Transfer molding method, die structure, transfer molding device, and optical member

A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the f...

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Hauptverfasser: Yamanaka, Yoshihisa, Hirota, Kazuhide, Taguchi, Toshikaga, Kojima, Masayuki, Shinohara, Masayuki, Kitamura, Norikazu, Shibata, Tomofusa, Takemura, Koichi, Takahashi, Yukihiro, Makuta, Isao
Format: Patent
Sprache:eng
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