Method of manufacturing conductive layer and wiring board

A method of manufacturing a conductive layer on a support body includes a first process of forming a precursor layer containing at least one of metal particles and metal oxide particles on the support body; a second process of forming a sintering layer by irradiating an electromagnetic wave pulse on...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kaizu, Masahiro, Ichikawa, Masateru
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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