Dense assembly of laterally soldered, overmolded chip packages

Embodiments of the invention are directed to an integrated circuit (IC) package assembly, including: one or more printed circuit boards (PCBs); and a set of chip packages, each including: an overmold; and an IC chip, overmolded in the overmold, and wherein: the chip packages are stacked transversely...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Brunschwiler, Thomas J, Doering, Andreas Christian, Sagmeister, Patricia Maria, Luijten, Ronald Peter, Oggioni, Stefano Sergio, Schmatz, Martin Leo
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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