Power supplying member and high-speed plating machine provided with the same
Providing a power-supplying member capable of desirably performing plating for a long period of time. A second power-supplying member is brought into contact with an article to be plated to apply negative voltage to the article. The article is disposed in a state such that a space in which a plating...
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| creator | Miyazaki, Toshihisa Mochizuki, Yoshitaka Takamatsu, Akira |
| description | Providing a power-supplying member capable of desirably performing plating for a long period of time. A second power-supplying member is brought into contact with an article to be plated to apply negative voltage to the article. The article is disposed in a state such that a space in which a plating solution flows is defined between an anode and the article. The second power-supplying member includes a center member made from copper and a covering member made from titanium and covering at least a part of a periphery of the center member. The part is wetted with the plating solution. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10006143B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10006143B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10006143B23</originalsourceid><addsrcrecordid>eNrjZPAJyC9PLVIoLi0oyKnMzEtXyE3NTQIKJOalKGRkpmfoFhekpqYoFOQkloBlE5MzMvNSFQqK8ssyU4AS5ZklGQolGakKxYm5qTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JD402NDAwMDM0MTYyciYGDUAnhs1yg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Power supplying member and high-speed plating machine provided with the same</title><source>esp@cenet</source><creator>Miyazaki, Toshihisa ; Mochizuki, Yoshitaka ; Takamatsu, Akira</creator><creatorcontrib>Miyazaki, Toshihisa ; Mochizuki, Yoshitaka ; Takamatsu, Akira</creatorcontrib><description>Providing a power-supplying member capable of desirably performing plating for a long period of time. A second power-supplying member is brought into contact with an article to be plated to apply negative voltage to the article. The article is disposed in a state such that a space in which a plating solution flows is defined between an anode and the article. The second power-supplying member includes a center member made from copper and a covering member made from titanium and covering at least a part of a periphery of the center member. The part is wetted with the plating solution.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180626&DB=EPODOC&CC=US&NR=10006143B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180626&DB=EPODOC&CC=US&NR=10006143B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Miyazaki, Toshihisa</creatorcontrib><creatorcontrib>Mochizuki, Yoshitaka</creatorcontrib><creatorcontrib>Takamatsu, Akira</creatorcontrib><title>Power supplying member and high-speed plating machine provided with the same</title><description>Providing a power-supplying member capable of desirably performing plating for a long period of time. A second power-supplying member is brought into contact with an article to be plated to apply negative voltage to the article. The article is disposed in a state such that a space in which a plating solution flows is defined between an anode and the article. The second power-supplying member includes a center member made from copper and a covering member made from titanium and covering at least a part of a periphery of the center member. The part is wetted with the plating solution.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAJyC9PLVIoLi0oyKnMzEtXyE3NTQIKJOalKGRkpmfoFhekpqYoFOQkloBlE5MzMvNSFQqK8ssyU4AS5ZklGQolGakKxYm5qTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JD402NDAwMDM0MTYyciYGDUAnhs1yg</recordid><startdate>20180626</startdate><enddate>20180626</enddate><creator>Miyazaki, Toshihisa</creator><creator>Mochizuki, Yoshitaka</creator><creator>Takamatsu, Akira</creator><scope>EVB</scope></search><sort><creationdate>20180626</creationdate><title>Power supplying member and high-speed plating machine provided with the same</title><author>Miyazaki, Toshihisa ; Mochizuki, Yoshitaka ; Takamatsu, Akira</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10006143B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>Miyazaki, Toshihisa</creatorcontrib><creatorcontrib>Mochizuki, Yoshitaka</creatorcontrib><creatorcontrib>Takamatsu, Akira</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Miyazaki, Toshihisa</au><au>Mochizuki, Yoshitaka</au><au>Takamatsu, Akira</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Power supplying member and high-speed plating machine provided with the same</title><date>2018-06-26</date><risdate>2018</risdate><abstract>Providing a power-supplying member capable of desirably performing plating for a long period of time. A second power-supplying member is brought into contact with an article to be plated to apply negative voltage to the article. The article is disposed in a state such that a space in which a plating solution flows is defined between an anode and the article. The second power-supplying member includes a center member made from copper and a covering member made from titanium and covering at least a part of a periphery of the center member. The part is wetted with the plating solution.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | Power supplying member and high-speed plating machine provided with the same |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T11%3A12%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Miyazaki,%20Toshihisa&rft.date=2018-06-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10006143B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |