Method for manufacturing light emitting device

Method for manufacturing light emitting device

A method for manufacturing a light emitting device includes: joining a light transmissive substrate and light emitting elements with top surfaces of the light emitting elements facing a bottom surface of the light transmissive substrate; separating the light transmissive substrate into a plurality o...

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1. Verfasser: Wakamatsu, Dai
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator Wakamatsu, Dai
description A method for manufacturing a light emitting device includes: joining a light transmissive substrate and light emitting elements with top surfaces of the light emitting elements facing a bottom surface of the light transmissive substrate; separating the light transmissive substrate into a plurality of light transmissive pieces such that one or more of the light emitting elements remains in a state joined to one of the light transmissive pieces after separation; mounting the light emitting element joined to the light transmissive piece on a mounting unit, with a bottom surface of the light emitting element facing a top surface of the mounting unit; removing a portion of the light transmissive piece such that a top surface of the light transmissive piece becomes a predetermined shape; and providing a light reflective member around the top surface of the light transmissive piece that remains after the portion of the light transmissive piece is removed.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Method for manufacturing light emitting device
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