Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier
Top and bottom metal plates of a DMB panel stack are simultaneously direct-bonded to the central ceramic sheet in a single high-temperature step. During this step, the DMB panel rests on an array of very small upwardly projecting ceramic contacts of a ceramic carrier. An amount of unoxidized carbon...
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| creator | Spann, Thomas |
| description | Top and bottom metal plates of a DMB panel stack are simultaneously direct-bonded to the central ceramic sheet in a single high-temperature step. During this step, the DMB panel rests on an array of very small upwardly projecting ceramic contacts of a ceramic carrier. An amount of unoxidized carbon (e.g., a layer of graphite) is disposed on each contact projection such that an amount of carbon is disposed between the top of the contact projection and the metal oxide skin of the bottom metal plate. The carbon bonds with oxygen from the metal oxide skin, thereby preventing connection or direct-bonding of the ceramic contact projection to the second metal plate. This reduces imperfections in the metal of the bottom plate and reduces the amount of ceramic particles bonded to metal at contact sites. As a result, less post-bonding processing is required to make a high quality DMB substrate. |
| format | Patent |
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During this step, the DMB panel rests on an array of very small upwardly projecting ceramic contacts of a ceramic carrier. An amount of unoxidized carbon (e.g., a layer of graphite) is disposed on each contact projection such that an amount of carbon is disposed between the top of the contact projection and the metal oxide skin of the bottom metal plate. The carbon bonds with oxygen from the metal oxide skin, thereby preventing connection or direct-bonding of the ceramic contact projection to the second metal plate. This reduces imperfections in the metal of the bottom plate and reduces the amount of ceramic particles bonded to metal at contact sites. As a result, less post-bonding processing is required to make a high quality DMB substrate.</description><language>eng</language><subject>ARTIFICIAL STONE ; CEMENTS ; CERAMICS ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS ; CONCRETE ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; LIME, MAGNESIA ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; REFRACTORIES ; SLAG ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; TREATMENT OF NATURAL STONE ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180619&DB=EPODOC&CC=US&NR=10000423B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180619&DB=EPODOC&CC=US&NR=10000423B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Spann, Thomas</creatorcontrib><title>Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier</title><description>Top and bottom metal plates of a DMB panel stack are simultaneously direct-bonded to the central ceramic sheet in a single high-temperature step. 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During this step, the DMB panel rests on an array of very small upwardly projecting ceramic contacts of a ceramic carrier. An amount of unoxidized carbon (e.g., a layer of graphite) is disposed on each contact projection such that an amount of carbon is disposed between the top of the contact projection and the metal oxide skin of the bottom metal plate. The carbon bonds with oxygen from the metal oxide skin, thereby preventing connection or direct-bonding of the ceramic contact projection to the second metal plate. This reduces imperfections in the metal of the bottom plate and reduces the amount of ceramic particles bonded to metal at contact sites. As a result, less post-bonding processing is required to make a high quality DMB substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ARTIFICIAL STONE CEMENTS CERAMICS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING LIME, MAGNESIA MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS REFRACTORIES SLAG SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF NATURAL STONE WELDING WORKING BY LASER BEAM |
| title | Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier |
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