Light-emitting diode package structure
A light-emitting diode (LED) package structure includes a substrate, an LED chip, an encapsulation layer, and a plurality of reflective particles. The LED chip is disposed on the substrate. The encapsulation layer is disposed on the substrate, and the LED chip is embedded within the encapsulation la...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A light-emitting diode (LED) package structure includes a substrate, an LED chip, an encapsulation layer, and a plurality of reflective particles. The LED chip is disposed on the substrate. The encapsulation layer is disposed on the substrate, and the LED chip is embedded within the encapsulation layer. The encapsulation layer includes a first layer and a second layer. The first layer surrounds the LED chip and contacts a side surface of the LED chip. The second layer covers the LED chip and the first layer. The reflective particles are distributed in the first layer. |
---|