Chip detachment apparatus and supporting plate thereof

Chip detachment apparatus and supporting plate thereof

A chip detachment apparatus includes a sleeve, a supporting plate and a pushing member wherein the supporting plate is coupled to the sleeve and the pushing member is installed in a through hole of the supporting plate. The supporting plate has a plurality of first air vents and a plurality of first...

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1. Verfasser: LEE, WEI-TA
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LEE, WEI-TA
description A chip detachment apparatus includes a sleeve, a supporting plate and a pushing member wherein the supporting plate is coupled to the sleeve and the pushing member is installed in a through hole of the supporting plate. The supporting plate has a plurality of first air vents and a plurality of first air slots wherein each of the first air slots has a first opening and a first bottom. The first opening is recessed into a top surface of the supporting plate and makes the first bottom visible. Each of the first air vents connects with each of the first air slots adjacent to the first air vents. The present disclosure attracts with an adhesive tape sticks with a wafer by the first air vents and the first air slots to make the adhesive tape departing from the wafer when the pushing member push, therefore improves the efficiency of chip detachment.
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Chip detachment apparatus and supporting plate thereof
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