Microelectromechanical module package structure with reduced noise interference

Microelectromechanical module package structure with reduced noise interference

A MEMS module package includes a housing with an accommodation chamber and an opening in communication with the accommodation chamber. The housing has a substrate and an electrically insulative cap capped on the substrate and defining with the substrate the accommodation chamber therebetween. A micr...

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Hauptverfasser: TU, MIN-TE, HUANG, CHINING, TIEN, JIUNG-YUE
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TU, MIN-TE
HUANG, CHINING
TIEN, JIUNG-YUE
description A MEMS module package includes a housing with an accommodation chamber and an opening in communication with the accommodation chamber. The housing has a substrate and an electrically insulative cap capped on the substrate and defining with the substrate the accommodation chamber therebetween. A micro electro-mechanical chip is installed on the substrate and located inside the accommodation chamber. The micro electro-mechanical chip has an action zone corresponding to the opening of the housing. A first conducting layer and a second conducting layer are respectively disposed on an inner surface and an outer surface of the electrically insulative cap.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Microelectromechanical module package structure with reduced noise interference
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