Substrate processing apparatus

Provided is a substrate processing apparatus. The positions of a first electrode and a second electrode are adjusted in advance in consideration of differences in coefficients of thermal expansion so that a short circuit created by contact between the first electrode and the second electrode is prev...

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Hauptverfasser: KIM, KI BUM, KIM, YONG-HYUN, LEE, JAE-WAN, KIM, YUN-HOE, SA, SEUNG YOUB, PARK, CHANG-KYUN, KIM, YOONJEONG, JUNG, GU HYUN
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creator KIM, KI BUM
KIM, YONG-HYUN
LEE, JAE-WAN
KIM, YUN-HOE
SA, SEUNG YOUB
PARK, CHANG-KYUN
KIM, YOONJEONG
JUNG, GU HYUN
description Provided is a substrate processing apparatus. The positions of a first electrode and a second electrode are adjusted in advance in consideration of differences in coefficients of thermal expansion so that a short circuit created by contact between the first electrode and the second electrode is prevented even in the case in which the first electrode and the second electrode are thermally expanded during processing. Even in the case in which the first electrode and the second electrode are thermally expanded due to an increase in temperature during processing, a short circuit between the first electrode and the second electrode can be prevented, and the uniformity of a thin film can be maintained in the substrate processing apparatus for processing a large substrate.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Substrate processing apparatus
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