Insulated-gate bipolar transistor (igbt) and fabricating method thereof

An insulated gate bipolar transistor (IGBT) includes: a semiconductor substrate having a top surface and a bottom surface extending in horizontal directions; an isolation region comprising a first silicon compound; a high thermal conductivity region comprising a second silicon compound and having a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: LIN, HUNG-TE
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator LIN, HUNG-TE
description An insulated gate bipolar transistor (IGBT) includes: a semiconductor substrate having a top surface and a bottom surface extending in horizontal directions; an isolation region comprising a first silicon compound; a high thermal conductivity region comprising a second silicon compound and having a bottom portion and a sidewall portion, wherein the second silicon compound has a thermal conductivity higher than silicon; a collector region of a first conductive type disposed on the isolation region; a buffer region of a second conductive type opposite to the first conductive type disposed on the collector region; a drift region of the second conductive type disposed on the buffer region; a body region of the first conductive type disposed in the drift region; and at least one source region of the second conductive type disposed in the body region. The isolation region encircles the high thermal conductivity region in the horizontal directions.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI856526BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI856526BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI856526BB3</originalsourceid><addsrcrecordid>eNqNyj0OwjAMQOEsDAi4g0cYuoBaMRfx070SY-U0ThopOFFs7g8DB2B53_LW5j6wvBMquSZ8CzaWnLCCVmSJornCPgarB0B24NHWOKNGDvAiXbIDXahS9luz8piEdj83Bm7X8fJoqOSJpOBMTDqNz-Hcdu2x6_vTH8sHDLM0Aw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Insulated-gate bipolar transistor (igbt) and fabricating method thereof</title><source>esp@cenet</source><creator>LIN, HUNG-TE</creator><creatorcontrib>LIN, HUNG-TE</creatorcontrib><description>An insulated gate bipolar transistor (IGBT) includes: a semiconductor substrate having a top surface and a bottom surface extending in horizontal directions; an isolation region comprising a first silicon compound; a high thermal conductivity region comprising a second silicon compound and having a bottom portion and a sidewall portion, wherein the second silicon compound has a thermal conductivity higher than silicon; a collector region of a first conductive type disposed on the isolation region; a buffer region of a second conductive type opposite to the first conductive type disposed on the collector region; a drift region of the second conductive type disposed on the buffer region; a body region of the first conductive type disposed in the drift region; and at least one source region of the second conductive type disposed in the body region. The isolation region encircles the high thermal conductivity region in the horizontal directions.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240921&amp;DB=EPODOC&amp;CC=TW&amp;NR=I856526B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240921&amp;DB=EPODOC&amp;CC=TW&amp;NR=I856526B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN, HUNG-TE</creatorcontrib><title>Insulated-gate bipolar transistor (igbt) and fabricating method thereof</title><description>An insulated gate bipolar transistor (IGBT) includes: a semiconductor substrate having a top surface and a bottom surface extending in horizontal directions; an isolation region comprising a first silicon compound; a high thermal conductivity region comprising a second silicon compound and having a bottom portion and a sidewall portion, wherein the second silicon compound has a thermal conductivity higher than silicon; a collector region of a first conductive type disposed on the isolation region; a buffer region of a second conductive type opposite to the first conductive type disposed on the collector region; a drift region of the second conductive type disposed on the buffer region; a body region of the first conductive type disposed in the drift region; and at least one source region of the second conductive type disposed in the body region. The isolation region encircles the high thermal conductivity region in the horizontal directions.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyj0OwjAMQOEsDAi4g0cYuoBaMRfx070SY-U0ThopOFFs7g8DB2B53_LW5j6wvBMquSZ8CzaWnLCCVmSJornCPgarB0B24NHWOKNGDvAiXbIDXahS9luz8piEdj83Bm7X8fJoqOSJpOBMTDqNz-Hcdu2x6_vTH8sHDLM0Aw</recordid><startdate>20240921</startdate><enddate>20240921</enddate><creator>LIN, HUNG-TE</creator><scope>EVB</scope></search><sort><creationdate>20240921</creationdate><title>Insulated-gate bipolar transistor (igbt) and fabricating method thereof</title><author>LIN, HUNG-TE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI856526BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LIN, HUNG-TE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIN, HUNG-TE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Insulated-gate bipolar transistor (igbt) and fabricating method thereof</title><date>2024-09-21</date><risdate>2024</risdate><abstract>An insulated gate bipolar transistor (IGBT) includes: a semiconductor substrate having a top surface and a bottom surface extending in horizontal directions; an isolation region comprising a first silicon compound; a high thermal conductivity region comprising a second silicon compound and having a bottom portion and a sidewall portion, wherein the second silicon compound has a thermal conductivity higher than silicon; a collector region of a first conductive type disposed on the isolation region; a buffer region of a second conductive type opposite to the first conductive type disposed on the collector region; a drift region of the second conductive type disposed on the buffer region; a body region of the first conductive type disposed in the drift region; and at least one source region of the second conductive type disposed in the body region. The isolation region encircles the high thermal conductivity region in the horizontal directions.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TWI856526BB
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Insulated-gate bipolar transistor (igbt) and fabricating method thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-09T17%3A12%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIN,%20HUNG-TE&rft.date=2024-09-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI856526BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true