Conductive structure, redistribution structure and forming method thereof

The present disclosure provides methods and structures to prevent cracks in redistribution layers. A redistribution structure according to the present disclosure includes a first polymer layer disposed over a silicon substrate, a first contact via disposed in the first polymer layer, a second polyme...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YANG, TIENUNG, CHUANG, YAOUN, LU, YINLUNG, HE, JUN, HUANG, LI-HSIEN, KUO, TING-TING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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