Package and manufacturing method of semiconductor device

A method of manufacturing a semiconductor device includes forming a first bonding layer over a substrate of a first wafer, the first wafer including a first semiconductor die and a second semiconductor die, performing a first dicing process to form two grooves that extend through the first bonding l...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHIOU, WENIH, YANG, CHING-FENG, WU, CHIH-WEI, SU, AN-JHIH, SHIH, YINGING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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