TWI852523B
PROBLEM TO BE SOLVED: To provide a copper foil for a flexible printed substrate, having good linear circuit properties and suitable for a minute circuit, and a copper-clad laminate, a flexible printed substrate and an electronic device using same. SOLUTION: A copper foil for a flexible printed subst...
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| creator | BANDO, SHINSUKE ISHINO, YUJI |
| description | PROBLEM TO BE SOLVED: To provide a copper foil for a flexible printed substrate, having good linear circuit properties and suitable for a minute circuit, and a copper-clad laminate, a flexible printed substrate and an electronic device using same. SOLUTION: A copper foil for a flexible printed substrate, which is a rolled copper foil comprising at least 99.96 mass% Cu, with the remainder being unavoidable impurities, wherein when 300°C heat treatment is carried out for 30 minutes and a measurement field of view of 150µm x 150µm of the rolling surface of the rolled copper foil is subjected to EBSD measurement, the average crystal diameter, when a misorientation of 5° or more is considered a crystal boundary, is not more than 5.0µm. |
| format | Patent |
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SOLUTION: A copper foil for a flexible printed substrate, which is a rolled copper foil comprising at least 99.96 mass% Cu, with the remainder being unavoidable impurities, wherein when 300°C heat treatment is carried out for 30 minutes and a measurement field of view of 150µm x 150µm of the rolling surface of the rolled copper foil is subjected to EBSD measurement, the average crystal diameter, when a misorientation of 5° or more is considered a crystal boundary, is not more than 5.0µm.</description><language>chi</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240811&DB=EPODOC&CC=TW&NR=I852523B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240811&DB=EPODOC&CC=TW&NR=I852523B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BANDO, SHINSUKE</creatorcontrib><creatorcontrib>ISHINO, YUJI</creatorcontrib><title>TWI852523B</title><description>PROBLEM TO BE SOLVED: To provide a copper foil for a flexible printed substrate, having good linear circuit properties and suitable for a minute circuit, and a copper-clad laminate, a flexible printed substrate and an electronic device using same. SOLUTION: A copper foil for a flexible printed substrate, which is a rolled copper foil comprising at least 99.96 mass% Cu, with the remainder being unavoidable impurities, wherein when 300°C heat treatment is carried out for 30 minutes and a measurement field of view of 150µm x 150µm of the rolling surface of the rolled copper foil is subjected to EBSD measurement, the average crystal diameter, when a misorientation of 5° or more is considered a crystal boundary, is not more than 5.0µm.</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfe0MDUyNTJ24mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEACbIbfA</recordid><startdate>20240811</startdate><enddate>20240811</enddate><creator>BANDO, SHINSUKE</creator><creator>ISHINO, YUJI</creator><scope>EVB</scope></search><sort><creationdate>20240811</creationdate><title>TWI852523B</title><author>BANDO, SHINSUKE ; ISHINO, YUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI852523BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2024</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>BANDO, SHINSUKE</creatorcontrib><creatorcontrib>ISHINO, YUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BANDO, SHINSUKE</au><au>ISHINO, YUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI852523B</title><date>2024-08-11</date><risdate>2024</risdate><abstract>PROBLEM TO BE SOLVED: To provide a copper foil for a flexible printed substrate, having good linear circuit properties and suitable for a minute circuit, and a copper-clad laminate, a flexible printed substrate and an electronic device using same. SOLUTION: A copper foil for a flexible printed substrate, which is a rolled copper foil comprising at least 99.96 mass% Cu, with the remainder being unavoidable impurities, wherein when 300°C heat treatment is carried out for 30 minutes and a measurement field of view of 150µm x 150µm of the rolling surface of the rolled copper foil is subjected to EBSD measurement, the average crystal diameter, when a misorientation of 5° or more is considered a crystal boundary, is not more than 5.0µm.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi |
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| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING |
| title | TWI852523B |
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