Front-side imager and process for manufacturing such an imager

The invention relates to a front-side imager comprising in succession: -a semiconductor carrier substrate, a first electrically insulating separating layer, and a single-crystal semiconductor layer, called the active layer, comprising a matrix array of photodiodes, wherein the imager further compris...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ECARNOT, LUDOVIC, SCHWARZENBACH, WALTER, SELLIER, MANUEL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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