Semiconductor device and method of forming the same

Semiconductor device and method of forming the same

Embodiments provide metal features which dissipate heat generated from a laser drilling process for exposing dummy pads through a dielectric layer. Because the dummy pads are coupled to the metal features, the metal features act as a heat dissipation feature to pull heat from the dummy pad. As a res...

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Bibliographische Detailangaben
Hauptverfasser: CHUANG, YAOUN, HE, JUN, CHEN, CHIEN-HUNG, HUANG, LI-HSIEN, CHIU, CHENG-PU, KUO, CHIEN-LI, LI, CHIENN, KUO, TING-TING
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments provide metal features which dissipate heat generated from a laser drilling process for exposing dummy pads through a dielectric layer. Because the dummy pads are coupled to the metal features, the metal features act as a heat dissipation feature to pull heat from the dummy pad. As a result, reduction in heat is achieved at the dummy pad during the laser drilling process.