Multi-die package and method of manufacturing the same

A multi-die package includes a plurality of non-active dies among the IC dies included in the multi-die package. The non-active dies may be included to reduce the amount of encapsulant material and/or an underfill material that is used in the multi-die package, which reduces the amount of CTE mismatch in the multi-die package. Moreover, a plurality of non-active dies may be positioned in an adjacent manner between two or more active IC dies. The use of a plurality of non-active dies in a particular area of the multi-die package increases the quantity of gaps in the multi-die package. The increased quantity of gaps in the multi-die package provides an increased amount of area in the multi-die package for stress and strain absorption, and enables more even distribution of stresses and strains in the multi-die package.