Image sensor integrated chip and method of forming the same

The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a substrate having a first side and a second side opposing the first side. The substrate has one or more sidewalls defining a trench extending along opposing sides of a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHOU, KENG-YU, HUANG, CHENG-YU, CHIANG, WEIIEH, HSU, TZU-HSUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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