Polishing pad, method for manufacturing polishing pad and polishing apparatus

The present disclosure relates to a polishing pad including a polishing layer. The polishing layer defines a plurality of foaming pores, and a diameter of each of the foaming pores is 1 μm to 10 μm. The present disclosure also relates to a method for manufacturing a polishing pad and a polishing app...

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Bibliographische Detailangaben
Hauptverfasser:	SONG, HSIN-RU, HUNG, YUNGANG, WU, JENG YI, HUNG, HSIENANG, YAO, I-PENG, WANG, LYANG-GUNG, HUANG, CHI CHE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GENERAL PROCESSES OF COMPOUNDING GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS POLISHING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	The present disclosure relates to a polishing pad including a polishing layer. The polishing layer defines a plurality of foaming pores, and a diameter of each of the foaming pores is 1 μm to 10 μm. The present disclosure also relates to a method for manufacturing a polishing pad and a polishing apparatus.