Composition for manufacturing passivation layer and passivation layer using the same
The present invention relates to a composition for manufacturing a passivation layer, and specifically, to a composition for manufacturing a passivation layer and a passivation layer formed using the composition, which simultaneously exhibit effects such as a low dielectric constant, a low water abs...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KIM, JINKUK JANG, SEUNGSUN KIM, HYOYEON KIM, BONGGYU CHEN, XUDONG JUNG, EUNHWA |
| description | The present invention relates to a composition for manufacturing a passivation layer, and specifically, to a composition for manufacturing a passivation layer and a passivation layer formed using the composition, which simultaneously exhibit effects such as a low dielectric constant, a low water absorption rate, excellent pattern formability, and excellent adhesion to an adherend surface. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI839452BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI839452BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI839452BB3</originalsourceid><addsrcrecordid>eNrjZAhxzs8tyC_OLMnMz1NIyy9SyE3MK01LTC4pLcrMS1coSCwuzixLBMvmJFamFikk5qVgES0tBqkuyUhVKE7MTeVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfEh4Z4WxpYmpkZOTsZEKAEAuVY5zg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Composition for manufacturing passivation layer and passivation layer using the same</title><source>esp@cenet</source><creator>KIM, JINKUK ; JANG, SEUNGSUN ; KIM, HYOYEON ; KIM, BONGGYU ; CHEN, XUDONG ; JUNG, EUNHWA</creator><creatorcontrib>KIM, JINKUK ; JANG, SEUNGSUN ; KIM, HYOYEON ; KIM, BONGGYU ; CHEN, XUDONG ; JUNG, EUNHWA</creatorcontrib><description>The present invention relates to a composition for manufacturing a passivation layer, and specifically, to a composition for manufacturing a passivation layer and a passivation layer formed using the composition, which simultaneously exhibit effects such as a low dielectric constant, a low water absorption rate, excellent pattern formability, and excellent adhesion to an adherend surface.</description><language>chi ; eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CORRECTING FLUIDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240421&DB=EPODOC&CC=TW&NR=I839452B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240421&DB=EPODOC&CC=TW&NR=I839452B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, JINKUK</creatorcontrib><creatorcontrib>JANG, SEUNGSUN</creatorcontrib><creatorcontrib>KIM, HYOYEON</creatorcontrib><creatorcontrib>KIM, BONGGYU</creatorcontrib><creatorcontrib>CHEN, XUDONG</creatorcontrib><creatorcontrib>JUNG, EUNHWA</creatorcontrib><title>Composition for manufacturing passivation layer and passivation layer using the same</title><description>The present invention relates to a composition for manufacturing a passivation layer, and specifically, to a composition for manufacturing a passivation layer and a passivation layer formed using the composition, which simultaneously exhibit effects such as a low dielectric constant, a low water absorption rate, excellent pattern formability, and excellent adhesion to an adherend surface.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAhxzs8tyC_OLMnMz1NIyy9SyE3MK01LTC4pLcrMS1coSCwuzixLBMvmJFamFikk5qVgES0tBqkuyUhVKE7MTeVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfEh4Z4WxpYmpkZOTsZEKAEAuVY5zg</recordid><startdate>20240421</startdate><enddate>20240421</enddate><creator>KIM, JINKUK</creator><creator>JANG, SEUNGSUN</creator><creator>KIM, HYOYEON</creator><creator>KIM, BONGGYU</creator><creator>CHEN, XUDONG</creator><creator>JUNG, EUNHWA</creator><scope>EVB</scope></search><sort><creationdate>20240421</creationdate><title>Composition for manufacturing passivation layer and passivation layer using the same</title><author>KIM, JINKUK ; JANG, SEUNGSUN ; KIM, HYOYEON ; KIM, BONGGYU ; CHEN, XUDONG ; JUNG, EUNHWA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI839452BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, JINKUK</creatorcontrib><creatorcontrib>JANG, SEUNGSUN</creatorcontrib><creatorcontrib>KIM, HYOYEON</creatorcontrib><creatorcontrib>KIM, BONGGYU</creatorcontrib><creatorcontrib>CHEN, XUDONG</creatorcontrib><creatorcontrib>JUNG, EUNHWA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, JINKUK</au><au>JANG, SEUNGSUN</au><au>KIM, HYOYEON</au><au>KIM, BONGGYU</au><au>CHEN, XUDONG</au><au>JUNG, EUNHWA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Composition for manufacturing passivation layer and passivation layer using the same</title><date>2024-04-21</date><risdate>2024</risdate><abstract>The present invention relates to a composition for manufacturing a passivation layer, and specifically, to a composition for manufacturing a passivation layer and a passivation layer formed using the composition, which simultaneously exhibit effects such as a low dielectric constant, a low water absorption rate, excellent pattern formability, and excellent adhesion to an adherend surface.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_TWI839452BB |
| source | esp@cenet |
| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS |
| title | Composition for manufacturing passivation layer and passivation layer using the same |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-18T07%3A07%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIM,%20JINKUK&rft.date=2024-04-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI839452BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |