TWI838479B

Provided are an adhesive film, a flat cable, and an insulating film excelling in toughness and adhesive strength, and capable of achieving a lower dielectric constant and a lower dielectric loss tangent. More specifically, an insulating film 4 is used in a flat cable 1. The insulating film 4 is form...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KOBASHI, KAZUNORI, MARUYAMA, YUTAKA, ITOU, DAISUKE, KUWAMURA, SHINICHI, OOTSUBO, TAKANORI
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS DYES ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided are an adhesive film, a flat cable, and an insulating film excelling in toughness and adhesive strength, and capable of achieving a lower dielectric constant and a lower dielectric loss tangent. More specifically, an insulating film 4 is used in a flat cable 1. The insulating film 4 is formed from a resin composition containing: a polyarylene sulfide-based resin (A); a polyphenylene ether-based resin (B); and a modified elastomer (C) having a reactive group capable of reacting with the polyarylene sulfide-based resin (A) and/or the polyphenylene ether-based resin (B). In the resin composition, the content of the polyarylene sulfide-based resin (A) is 50-93 mass%, and the content of the polyphenylene ether-based resin (B) is 3-40 mass%.