TWI837294B

Disclosed is a reactive hot-melt adhesive composition, containing: a urethane prepolymer having a polymer chain including a structural unit derived from polyol and a structural unit derived from polyisocyanate, and an isocyanate group as a terminal group of the polymer chain; and a functional group...

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Hauptverfasser: KAMEI, JUNICHI, KOMIYA, SOUICHIROU, KURAMOCHI, CHIKA
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Sprache:chi
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creator KAMEI, JUNICHI
KOMIYA, SOUICHIROU
KURAMOCHI, CHIKA
description Disclosed is a reactive hot-melt adhesive composition, containing: a urethane prepolymer having a polymer chain including a structural unit derived from polyol and a structural unit derived from polyisocyanate, and an isocyanate group as a terminal group of the polymer chain; and a functional group protection type silane coupling agent.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI837294BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI837294BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI837294BB3</originalsourceid><addsrcrecordid>eNrjZOAKCfe0MDY3sjRx4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEADeIblA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TWI837294B</title><source>esp@cenet</source><creator>KAMEI, JUNICHI ; KOMIYA, SOUICHIROU ; KURAMOCHI, CHIKA</creator><creatorcontrib>KAMEI, JUNICHI ; KOMIYA, SOUICHIROU ; KURAMOCHI, CHIKA</creatorcontrib><description>Disclosed is a reactive hot-melt adhesive composition, containing: a urethane prepolymer having a polymer chain including a structural unit derived from polyol and a structural unit derived from polyisocyanate, and an isocyanate group as a terminal group of the polymer chain; and a functional group protection type silane coupling agent.</description><language>chi</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240401&amp;DB=EPODOC&amp;CC=TW&amp;NR=I837294B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240401&amp;DB=EPODOC&amp;CC=TW&amp;NR=I837294B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAMEI, JUNICHI</creatorcontrib><creatorcontrib>KOMIYA, SOUICHIROU</creatorcontrib><creatorcontrib>KURAMOCHI, CHIKA</creatorcontrib><title>TWI837294B</title><description>Disclosed is a reactive hot-melt adhesive composition, containing: a urethane prepolymer having a polymer chain including a structural unit derived from polyol and a structural unit derived from polyisocyanate, and an isocyanate group as a terminal group of the polymer chain; and a functional group protection type silane coupling agent.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfe0MDY3sjRx4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEADeIblA</recordid><startdate>20240401</startdate><enddate>20240401</enddate><creator>KAMEI, JUNICHI</creator><creator>KOMIYA, SOUICHIROU</creator><creator>KURAMOCHI, CHIKA</creator><scope>EVB</scope></search><sort><creationdate>20240401</creationdate><title>TWI837294B</title><author>KAMEI, JUNICHI ; KOMIYA, SOUICHIROU ; KURAMOCHI, CHIKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI837294BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2024</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>KAMEI, JUNICHI</creatorcontrib><creatorcontrib>KOMIYA, SOUICHIROU</creatorcontrib><creatorcontrib>KURAMOCHI, CHIKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAMEI, JUNICHI</au><au>KOMIYA, SOUICHIROU</au><au>KURAMOCHI, CHIKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI837294B</title><date>2024-04-01</date><risdate>2024</risdate><abstract>Disclosed is a reactive hot-melt adhesive composition, containing: a urethane prepolymer having a polymer chain including a structural unit derived from polyol and a structural unit derived from polyisocyanate, and an isocyanate group as a terminal group of the polymer chain; and a functional group protection type silane coupling agent.</abstract><oa>free_for_read</oa></addata></record>
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subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
title TWI837294B
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T09%3A51%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KAMEI,%20JUNICHI&rft.date=2024-04-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI837294BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true