TWI833812B

Disclosed is a photo-curing resin composition for electronic device with excellent coating characteristic and curability and low dielectric constant. The photo-curing resin composition for electronic device of the invention comprises a curable resin and a polymerization initiator. The curable resin...

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Bibliographische Detailangaben
Hauptverfasser:	MASUI, RYOHEI, YAMAMOTO, TAKUYA, SHICHIRI, TOKUSHIGE, SASANO, MIKA, NISHIUMI, YUKI, KIM, CHIZURU, SHITASHIMA, KEN
Format:	Patent
Sprache:	chi
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Disclosed is a photo-curing resin composition for electronic device with excellent coating characteristic and curability and low dielectric constant. The photo-curing resin composition for electronic device of the invention comprises a curable resin and a polymerization initiator. The curable resin contains a monofunctional cationic polymerizable compound and a polyfunctional cationic polymerizable compound, and the aforementioned monofunctional cationic polymerizable compound includes at least any one of a monofunctional aliphatic cationic polymerizable compound and a monofunctional cationic polymerizable compound with substituted phenoxy group. The photo-curing resin composition for electronic device has a dielectric constant of 3.5 or less when measured at 25 DEG C and 100 kHz.