Substrate treating apparatus and substrate treating method

Substrate treating apparatus and substrate treating method

The inventive concept provides a substrate treating method. The substrate treating method comprising: a liquid treating step for cleaning a substrate by supplying a treating liquid to the substrate in a first process chamber; a transfer step for transferring the substrate to a second process chamber...

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Hauptverfasser: JUNG, JINWOO, LEE, YOUNG HUN, YOON, DO HYEON
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator JUNG, JINWOO
LEE, YOUNG HUN
YOON, DO HYEON
description The inventive concept provides a substrate treating method. The substrate treating method comprising: a liquid treating step for cleaning a substrate by supplying a treating liquid to the substrate in a first process chamber; a transfer step for transferring the substrate to a second process chamber after the liquid treating step; and a drying step for removing the treating liquid remaining on the substrate in the second process chamber, and wherein the method further comprises a standby step of a liquid treated substrate to standby in the first process chamber when the liquid treated substrate of the liquid treating step cannot be transferred to the second process chamber, and at the standby step the treating liquid is discharged until the substrate can be transferred to the second process chamber.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Substrate treating apparatus and substrate treating method
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